I Electronic Materials leh Microcircuits Supplier lar ber berte
Luoyang Zhongchao New Material Co., Ltd. (hetah hian "ZC-TECH" tia sawi tur) hi China ram Henan Province-a Industrial Cluster Zone-ah a awm a, acre 60 chuang zeta zau a ni. Kum 2003-a din a ni a, professional research leh development, production, leh environment friendly leh pollution-free material thar hralhna te inzawmkhawmtu enterprise a ni. A thil siam chhuah ber chu aluminium based super fine flame-retardant material leh magnesium based super fine flame-retardant material, special alumina, spherical alumina, boehmite, advanced ceramics, electronic ceramics leh inorganic material dangte a ni.
Filling sang, meikhu tlem, leh halogen-free application te ang chi mamawh bik atan formula design customized pe rawh.
Low Temperature Co-fired Ceramic hman thatna
Ceramic materials hian high frequency, high speed transmission leh wide pass band characteristics tha tak tak a nei a.ingredient hrang hrang a zirin ltcc material dielectric constant hi a danglam thei hle. Conductor material atana conductivity sang tak nei metal material hman nen a inzawm chuan circuit system quality factor tihchangtlun leh circuit design flexibility tihpun a hlawkthlak hle.
Current sang leh temperature sang resistance mamawh angin a insiamrem thei a, pcb subgrade board pangngai aiin thermal conductivity tha zawk a nei a, electronic hmanrua heat dissipation design nasa takin a ti tha a, rintlakna sang tak a nei a, boruak khirh takah pawh hman theih a ni a, a service life pawh a ti rei thei bawk
Electric subgrade board layer tam tak nei chu siam theih a ni a, a chhungah passive component tam tak dah theih a ni a, hei hian component packaging man a ti bo a ni. Layer tamna three-dimensional electric subgrade board-ah chuan passive leh active component-te inzawmkhawmna chu a thleng thei a, hei hian circuit assembly density tihchangtlunna leh volume leh weight tihhniam belhna atan a \\ha hle.
Multilayer cabling technology dang nen a inmil a, chu chu ltcc leh thin-film cabling technology nena inzawm a, assembly density sang zawk leh hybrid multilayer substrate leh hybrid multichip components te performance tha zawk neih theihna tur a ni
Discontinuous production technology hian layer wiring tin quality inspection a ti awlsam a, product siam zawh hmaa hole hmanga interconnect theih a ni a, hei hian multilayer substrate yield leh quality tihsan nan, production cycle tih tawi nan leh cost tihtlem nan a hlawkpui hle.
Low Temperature Co-fired Ceramic hmanga siam a ni
Telecommunications lam hawi:
RF module leh antenna-a hman thin LTCC hian high-frequency signal transmission a ti thei a, hloh tlem ber a ni a, wireless communication quality a ti tha hle.
01
Aerospace & defense lam hawi:
Radar system, satellite communication, leh sipai electronics atana hmanraw rintlak, rit lo tak tak, boruak khirh tak tuar thei tur a pe a ni.
02
Damdawi hmanrua: 1.1.
Miniaturized imaging equipment, implantable devices, leh integrated electronics hmanga portable diagnostic tools te a siamsak bawk.
03
Automotive lam hawi:
Driver-assistance system (ADAS), sensor, leh in-car communication module te chakna a pe a, himna leh inzawmna a tichak bawk.
04
Consumer electronics hman tur:
Smartphone, wearables, leh IoT devices compact, high-frequency circuit mamawhna te a support.
05
Product parameter hmanga siam a ni
|
Thil |
Technical Index a ni |
|
Hole Diameter kal tlangin |
0.2 mm,0.15 mm a ni |
|
Punching Position dik tak a ni |
±10 µm |
|
Stacking dik tak a ni |
±10 µm |
|
Line Width Thinest ber Printing |
75 µm |
|
Film Thickness dik tak a ni |
±2 µm |
|
Bond chakna |
>3 g(25 μm Diameter Rangkachak thread) a ni. |
|
Film Adhesion a ni |
>0.5 kg/mm2 a ni |
|
Layers awm zat |
5~30 Layers a awm |
Thin Film Circuit Technology hman tangkai dan
Miniaturization hmanga siam:
Thin-film technology hmang hian circuit compact tak tak siam theih a ni a, chu chuan hmun tlem zawka hmanna atan a tha hle.
Frequency sang tak chu:
Thin-film circuit hian frequency sang takah performance tha tak a lantir a, hei hian RF leh microwave system-a hman atan a tha hle.
Performance sang tak chu:
Material quality sang - hman leh siam dan dik tak hman hian circuit performance characteristic tha tak tak a siam chhuak thin.
Power hman tlem:
Thin-film circuit hian circuit technology dang nena khaikhin chuan power consumption a nei tlem zawk fo thin.
Rinawmna: 1.1.
Thin-film siam dan hian thilte chu adhesion leh stability tha tak a siam a, chu chuan circuit te rintlak leh dam rei theihna a tipung a ni.
Thin Film Circuit Technology hman dan tur
Optoelectronics leh display hrang hrang:
Thin-film coatings hmang hian transparent conductive layer, anti-reflective coatings, leh light-emitting layer siam theih a ni a, hei hian optoelectronic devices te performance leh visual quality a ti sang hle.
Semiconductor leh integrated circuit te chu:
Thin-film technology hian semiconductor leh integrated circuit (IC) siamna kawngah hmun pawimawh tak a chang a ni. Material layer te tak te, silicon dioxide (SiO2) emaw silicon nitride (Si3N4) emaw te chu insulating layer emaw gate dielectrics angin a dah thei a ni. Thin film hian IC siamna kawngah conductive pathway, interconnect, leh metalization layer siam a ti awlsam bawk.
Optics leh photonics te chu:
Thin film hi optical component leh system-ah te hman a ni nasa hle. Anni hian lens leh mirror-a anti-reflective coatings siam theihna a siam a, chu chuan light reflection a ti tlem a, light transmission a ti sang thei bawk.
Sensor leh biosensor te hi:
Thin-film technology hian industry hrang hrang tan sensor leh biosensor siamna kawngah hmanna a hmu a. Thin film hmang hian target analyte emaw environmental condition emaw nena inzawm sensitive layer siam theih a ni a, chu chuan physical, chemical, biological parameters te chu a hmuchhuak thei a ni.
Energy khawlkhawm leh thlak danglam: 1.1.
Thin film hian energy khawlkhawm leh conversion technology-ah hmun pawimawh tak a chang a ni. Battery leh fuel cell-ah chuan thin film te hi venhimna coating, separator material leh catalyst layer atan hman a ni a, hei hian performance, durability leh efficiency a ti sang a ni. Thin-film solar cells, amorphous silicon (a-Si) emaw cadmium telluride (CdTe) ang chi thil hmanga siam thin-film photovoltaics (TFPV) te hian traditional silicon-based solar cells aiin a danglamna a pe a ni.
Microelectromechanical system (MEMS) hmanga siam a ni a: 1.1.
Thin-film technology hi MEMS device siamna atana pawimawh tak a ni. Thin film hmang hian MEMS siamnaah structural layer, piezoelectric material leh conductive traces siam a ni a, microscale-a physical phenomena te chu chiang taka control leh manipulation theih a ni.
Product parameter hmanga siam a ni
|
Thil |
Technical Index a ni |
|
Through Hole hmangin |
Substrate thuk zawng×0.8 |
|
A atanga hlat zawng tlem ber Guide Band chu Ceramic sir lam panna tur a ni |
0.050 mm a ni |
|
Lithographic Line zau zawng tlem ber |
0.015mm a ni |
|
Doletna |
±10% |
Hriatpuina lehkha
fAQ tih hi a ni
China rama electronic material leh microcircuit siamtu leh supplier lar ber pawl anga hriat kan ni -. Hetah hian kan factory atang hian China rama siam electronic material leh microcircuit quality tha tak tak lei theih a ni. Price consultation duh tan min rawn biak theih reng e.